To provide a die bonding apparatus for introducing automation for mounting a semiconductor laser crystal to a metal stem and mounting the semiconductor laser crystal to the component mounting surface of the stem with higher accuracy.

In the die bonding apparatus 1, the semiconductor laser crystal S attracted by a bonding nozzle 17 at a predetermined place is transferred to the stem 2 mounted to a stem mounting head 6 from attracting nozzles 5A, 5B and is then arranged on a component mounting surface 27. A solder material placed between the component mounting surface 27 and semiconductor laser crystal S is fused in a heater 9 and is then cured. Accordingly, the semiconductor laser crystal S is fixed to the stem 2. Before the semiconductor laser crystal S is mounted to the stem 2, one side surface 72 of the semiconductor laser crystal S under the condition that it is attracted by the bonding nozzle 17 is imaged by a first image pickup camera 61 provided opposed to the side surface 72, while the other side surface 73 of the semiconductor laser crystal S is imaged by a second image pickup camera 62 provided opposed to the side surface.