To provide a die bonding material for an optical semiconductor device, which strikes a balance between the suppression of stringing and the suppression of oozing.
The die bonding material for an optical semiconductor device includes: a silicone resin which can be reacted in a hydrosilylation manner; a catalyst for hydrosilylation reaction; and silicon oxide particles. The viscosity of the silicone resin in 10 rpm at 25°C, measured using an E-type viscometer, is 1,000 to 6,000 mPa s. The viscosity of the die bonding material in 10 rpm at 25°C, measured using an E-type viscometer, is 8,000 to 30,000 mPa s. Further, the ratio of the viscosity of the die bonding material in 1 rpm at 25°C measured using an E-type viscometer to the viscosity in 10 rpm at 25°C measured using an E-type viscometer is 1.5 to 3.0.
WATANABE TAKASHI
Table of contents Makoto
Tomoyuki Ishimura
Kazutoshi Nakayama