To provide a die bonding material for an optical semiconductor device that exhibits high thermal conductivity, hardly causes a crack in the optical semiconductor device using the die bonding material, and suppresses a tilt of the optical semiconductor device laminated using the die bonding material.
The die bonding material for an optical semiconductor device includes: a first silicone resin having a hydrogen atom combined with a silicon atom; a second silicone resin having no hydrogen atom combined with a silicon atom and having an alkenyl group; a hydrosilylation reaction catalyst; and at least one of anhydrous magnesium carbonate not containing crystal water represented by a chemical formula MgCO3 and a coating body in which a surface of the anhydrous magnesium carbonate is coated with organic resin, silicone resin, or silica. An aspect ratio of the material is 5 or less.
TANIGAWA MITSURU
WATANABE TAKASHI
