Title:
DIE DIVISION DEVICE
Document Type and Number:
Japanese Patent JP3413309
Kind Code:
B2
Abstract:
PURPOSE: To improve work efficiency by setting hole working areas which are not overlapped into one division group, setting only hole working areas which are overlapped with the other hole working areas into one division group and deciding division lines for the respective division groups.
CONSTITUTION: Function for automatically dividing a die block 20 used in the respective stages of respective blanking into plural small blocks for grinding the holes is provided. A system control part 30 controls a whole die division device 28. A storage means 32 previously stores various pieces of data and the operation program of a computer constituting the system control part 30 and a division line deciding means. Namely, a first area G where shape data of the die block 20 and shape data of the hole work areas corresponding to the respective holes are stored, a second area H where shape data of a grinding edge is stored and a third area where the hole work area and shape data of the die block 20 are stored as graphic data on an orthogonal coordinate plane are included.
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Inventors:
Keisuke Yoshizawa
Application Number:
JP12401695A
Publication Date:
June 03, 2003
Filing Date:
May 23, 1995
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
B23Q15/00; G05B19/4097; (IPC1-7): G05B19/4097; B23Q15/00
Domestic Patent References:
| JP35027A | ||||
| JP6440256A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)