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Title:
DIE SUPPORTING STRUCTURE
Document Type and Number:
Japanese Patent JP2011173133
Kind Code:
A
Abstract:

To provide a die supporting structure that brings matching faces of a die into sure contact with each other in a simple structure and that thereby prevents occurrence of molding defects due to leakage of a material.

This is a die supporting structure of a die 5 comprising a movable die 11 that is fixed to a movable die base 3 with a clamp 20 for a movable die and a fixed die that is fixed to a fixed die base with a clamp for a fixed die. In the periphery of the clamp 20 for the movable die, a spacer 22 for a movable die is arranged that allows relative descent of the movable die 11 for a definite dimension δ by gravity when the movable die 11 is separated from the fixed die, that is structured in a manner capable of relatively pushing up the movable die 11 within the specific dimension δ at the time of matching of the movable die 11 with the fixed die, and that is composed of a rigid body. In the periphery of the clamp for the fixed die, a spacer for a fixed die is arranged that allows relative movement of the fixed die within the matching face plane at the time of matching of the movable die with the fixed die and that is composed of a rigid body.


Inventors:
OIKAWA KATSUFUMI
SASAKI RYOICHI
ONO NAOYA
TSUJI YUKINORI
Application Number:
JP2010037192A
Publication Date:
September 08, 2011
Filing Date:
February 23, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
B22C9/06; B22C9/10; B22D17/22
Attorney, Agent or Firm:
Patent Business Corporation Kushibuchi International Patent Office