Title:
DIE UNIT
Document Type and Number:
Japanese Patent JP2016137432
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a die unit capable of following torsion and deflection of a wire with a simple structure, and used for film formation on the wire.SOLUTION: A die unit includes a die having an open hole penetrating from one end face to the other end face, a bearing member positioned on one end face side of the die, and a connection member for connecting the die to the bearing member. The connection member supports the die movably by fulcruming the bearing member, and the bearing member supports the connection member and the die oscillatably by using itself as the center of oscillation.SELECTED DRAWING: Figure 1
Inventors:
ITO MOTOMICHI
FUNAYAMA YASUHIRO
SATO TAKUMI
FUNAYAMA YASUHIRO
SATO TAKUMI
Application Number:
JP2015013113A
Publication Date:
August 04, 2016
Filing Date:
January 27, 2015
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
B05C3/15; H01B13/00; H01B13/16
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