Title:
DIRECT HEAT SOLDERING PIPE
Document Type and Number:
Japanese Patent JP2018069252
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a direct heat soldering pipe easy in cleaning of flux, and capable of quickly raising to the melting temperature of a solder piece.SOLUTION: A direct heat soldering pipe comprises a cylindrical pipe 10 having an inner diameter capable of dropping a solder piece, a cylindrical core 20 having an inner diameter slightly larger than an outer diameter of the pipe, a sleeve 30 having a cylindrical body part and a truncated cone cylindrical tip part, having an inner diameter of the body part larger than an outer diameter of the core and having an inner diameter of the tip part smaller than the outer diameter of the core and slightly larger than the outer diameter of the pipe and holding means, and the pipe is composed of a material excellent in heat conductivity and undesirable in wettability with solder in an inner peripheral surface of the pipe, and the core is composed of a material excellent in heat conductivity, and has a heating element for melting the solder piece at least in the vicinity of a lower end part, and at least the pipe is attachable to/detachable from the holding means, and the pipe is inserted into the core, and the core is inserted into the sleeve, and the relative positional relationship between the pipe, the core and the sleeve is held by the holding means.SELECTED DRAWING: Figure 1
Inventors:
HIROSAKI KOICHI
Application Number:
JP2016208095A
Publication Date:
May 10, 2018
Filing Date:
October 24, 2016
Export Citation:
Assignee:
APOLLO SEIKO LTD
International Classes:
B23K3/02; B23K1/00; B23K3/03; B23K3/06
Domestic Patent References:
| JP2004209506A | 2004-07-29 | |||
| JP2015166098A | 2015-09-24 |
Attorney, Agent or Firm:
Takeshi Katsura