Title:
方向性結合器および高周波モジュール
Document Type and Number:
Japanese Patent JP6510350
Kind Code:
B2
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Inventors:
Ken Hasegawa
Application Number:
JP2015147836A
Publication Date:
May 08, 2019
Filing Date:
July 27, 2015
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01P5/18
Domestic Patent References:
| JP2008078853A | ||||
| JP2011023785A |
Foreign References:
| US5689217 |