Title:
DIVIDING DEVICE FOR STUCK SUBSTRATE AND BREAKING BLADE
Document Type and Number:
Japanese Patent JP2016022737
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a dividing device which can suitably divide a stuck substrate, and a breaking blade.SOLUTION: A dividing device has a breaking blade, which has a lengthwise direction along a scribe line. In the breaking blade, a tip thereof formed along the lengthwise direction is round chamfered, a scribe line is formed on one principal surface at a division planning position, and a protective layer is formed on the other principal surface. When the tip is brought into contact with a stuck substrate along a groove thereof which is provided on the protective layer in such a manner that an area of a predetermined width including the division planning position is exposed, the braking blade contacts only two end parts of the protective layer which are horizontally separated from each other with the division planning position interposed therebetween and form side parts of the groove part.SELECTED DRAWING: Figure 2
Inventors:
TAKEDA MASAKAZU
MURAKAMI KENJI
TAMURA KENTA
HIDESHIMA MAMORU
HASHIMOTO TAICHI
KURIYAMA NORIYOSHI
ISOKAWA HISAJI
MURAKAMI KENJI
TAMURA KENTA
HIDESHIMA MAMORU
HASHIMOTO TAICHI
KURIYAMA NORIYOSHI
ISOKAWA HISAJI
Application Number:
JP2015035536A
Publication Date:
February 08, 2016
Filing Date:
February 25, 2015
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD
International Classes:
B28D5/00; C03B33/10; H01L21/301
Domestic Patent References:
| JP2007015891A | 2007-01-25 | |||
| JP2014083821A | 2014-05-12 |
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