Title:
DOUBLE-SIDE LAPPING METHOD FOR PLATE-LIKE BODY HAVING WARP
Document Type and Number:
Japanese Patent JP2014161934
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a double-side lapping method that causes no spring-back phenomenon after completion of grind polishing with the application of pressure and enables efficient grind polishing while removing warp.SOLUTION: After an adhesive and curable synthetic resin is applied on the front and back surfaces of a plate-like body 1 that is the workpiece to form a hard synthetic resin layer so that front and back surfaces of the plate-like body may be almost parallel planes, the plate-like body 1 is sandwiched by a pair of the upper and lower turning surface tables 4 of a double-side lapping plate to make the turning surface tables 4 reversely rotate with each other while applied with pressure, so that firstly the hard synthetic resin layer and then the front and back surfaces of the plate-like body 1 coated with this layer are grind polished sequentially by a polishing body remaining fixed on the slide mating surface of the turning surface tables 4 to cut off a protrusion part caused by warp, thereby the warp of the plate-like body 1 is eliminated to obtain a parallel plane having a desired smoothness.
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Inventors:
SHIRAHATA TAKASHI
FUJIMORI YUKIHIRO
KONISHI MICHIAKI
FUJIMORI YUKIHIRO
KONISHI MICHIAKI
Application Number:
JP2013033356A
Publication Date:
September 08, 2014
Filing Date:
February 22, 2013
Export Citation:
Assignee:
YACHIYO MICROSCIENCE INC
International Classes:
B24B37/04
Attorney, Agent or Firm:
Shigeru Fujiyoshi
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