Title:
薄板円板状ワークの両面研削方法および装置
Document Type and Number:
Japanese Patent JP3829239
Kind Code:
B2
Abstract:
A double side grinding apparatus comprises a pair of grinding wheels (4), work rotating device (1) and moving device (2). The apparatus operates to bring the grinding faces (4a) into contact with the respective work surfaces (a) to advance each grinding face to the position of a predetermined depth of cut by moving at least one of the grinding wheels (4) while rotating the grinding wheels (4) and rotating the work (W) by the device (1) about an axis thereof as supported in a predetermined grinding position so that an outer periphery of the work (W) intersects outer peripheries of the grinding wheels (4) with a center (c) of the work (W) positioned inwardly of the grinding faces (4a), stop each of the grinding wheels (4) from advancing in the direction of depth of cut, move each of the grinding wheels (4) and the work (W) by the moving device (2) relative to each other in a direction parallel to the work surface (a) until the center (c) of the work (W) is positioned externally of the grinding faces (4a), and separate the grinding faces (4a) from the work surfaces (a). The surfaces of the work can be ground at the same time easily with diminished variations in the thickness of the work although the apparatus is small-sized.
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Inventors:
Tadahiro Kato
Shunichi Ikeda
Kenji Okura
Shunichi Ikeda
Kenji Okura
Application Number:
JP2001524765A
Publication Date:
October 04, 2006
Filing Date:
September 13, 2000
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
Koyo Machine Industry Co., Ltd.
Koyo Machine Industry Co., Ltd.
International Classes:
B24B7/17; B24B7/22
Domestic Patent References:
| JP10128646A | ||||
| JP9309049A | ||||
| JP11207577A | ||||
| JP6434650A | ||||
| JP10217079A |
Attorney, Agent or Firm:
Einosuke Kishimoto
Moriichi Kishimoto
Akira Watanabe
Norihiko Hibi
Kiyosue Yasuko
Moriichi Kishimoto
Akira Watanabe
Norihiko Hibi
Kiyosue Yasuko