Title:
基板裏面研磨部材のドレッシング装置及びドレッシング方法
Document Type and Number:
Japanese Patent JP7169769
Kind Code:
B2
Abstract:
An object of the invention is to prevent cleaning liquid and sludge and the like from splashing onto the surroundings when cleaning and dressing a polishing member that polishes the rear surface of a substrate. A dressing device 200 incorporates a bath member 203 which comprises a top panel section 201 and a cylindrical skirt section 202 provided on the bottom surface side of the top panel section 201, so as to be able to house a polishing pad 131 from above. The bath member 203 comprises a two-fluid nozzle 204 which ejects a cleaning liquid and a gas onto a polishing surface of the polishing pad, a dress board 205 capable of contacting the polishing surface of the polishing pad 131, and a rinse nozzle 206 which supplies a rinse to the contact surface between the polishing surface of the polishing pad 131 and the dress board 205. Splashing of the cleaning liquid, polishing debris, and sludge onto the surroundings is prevented by the skirt section 202.
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Inventors:
Yoshiki Okamoto
Yasushi Takiguchi
Akihiro Kubo
Hayato Hosaka
Ryuto Koshino
Yasushi Takiguchi
Akihiro Kubo
Hayato Hosaka
Ryuto Koshino
Application Number:
JP2018095095A
Publication Date:
November 11, 2022
Filing Date:
May 17, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B53/017; B24B49/12; H01L21/304
Domestic Patent References:
| JP2006319249A | ||||
| JP2009302503A | ||||
| JP2004071717A | ||||
| JP2016215342A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Koji Hagiwara
Naoki Ogita
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