Title:
DRESSING METHOD
Document Type and Number:
Japanese Patent JP3665523
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent missing of diamond abrasive grains in CMP using high corrosive slurry.
SOLUTION: In dressing process of a polishing pad 2 used for CMP, a solution 4 of pH 9-12 is poured over a polishing pad 2 to deoxidize oxidation agent of slurry remaining on the polishing pad 2. Missing of diamond abrasive grains is, thereby prevented.
Inventors:
Kubota Takeo
Application Number:
JP37353499A
Publication Date:
June 29, 2005
Filing Date:
December 28, 1999
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
B23H5/00; B24B53/017; B24B53/02; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Domestic Patent References:
| JP9155732A | ||||
| JP11126769A | ||||
| JP10277919A | ||||
| JP10315131A | ||||
| JP10321572A |
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Atsushi Tsuboi
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
Sadao Muramatsu
Atsushi Tsuboi
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
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