乾燥装置及び乾燥処理方法 - 東京エレクトロン株式会社

Title:

乾燥装置及び乾燥処理方法

Document Type and Number:

Japanese Patent JP6639175

Kind Code:

B2

Abstract:

To reduce effects of moisture mixed into a treatment container as much as possible when drying an organic material film on a substrate. A drying device 100 includes: a treatment container 1 that enables vacuuming; and a substrate support section 3 serving as a substrate support section for supporting a substrate S in the treatment container 1. During drying treatment, when the pressure in the treatment container 1 is from atmospheric pressure to 500 Pa, the substrate S is held at a first height position, and when the pressure in the treatment container 1 is equal to or lower than 3 Pa, the substrate S is lowered to a second height position that is lower than the first height position. By performing decompression exhaust while the substrate S is held at the first height position, moisture in the treatment container 1 can be promptly discharged from an exhaust port 11a of a bottom wall 11.

Inventors:

Akinori Shimamura
Teruyuki Hayashi

Application Number:

JP2015191651A

Publication Date:

February 05, 2020

Filing Date:

September 29, 2015

Export Citation:

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