PURPOSE: To provide a method for drying a resist film by which it is possible to detect a drying position easily without being influenced by the thickness of the resist film and dry the resist film as predetermined at a desired spot in a drying furnace as well as a device using the method.
CONSTITUTION: A resist film drying device which enables a band-like raw material 7 with an applied resist film to be dried by transporting the material 7 in a longitudinal direction and allowing it to pass through a drying furnace 1, is provided with a raw material temperature measuring means 3 which measures the temperatures of the raw materials at mutually different positions in the transport direction of the raw material 7 in a drying furnace 1, and an atmospheric temperature measuring means 4 which measures the temperature of an atmosphere at each position where the temperature of the raw material is measured in the drying furnace. In addition, the device is provided with a drying conditions adjustment means 2 which adjusts the intra-furnace drying conditions so that the resist film is dried as predetermined at a desired position in the drying furnace, from a position where the temperature of the raw material at each position is mutually equal to the temperature of the atmosphere.
SATO SEIICHIRO