Title:
【発明の名称】半導体装置の製法
Document Type and Number:
Japanese Patent JPH0810694
Kind Code:
B2
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Inventors:
Nobuyuki Izawa
Toshihiko Suzuki
Toshihiko Suzuki
Application Number:
JP23536986A
Publication Date:
January 31, 1996
Filing Date:
October 02, 1986
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/324; (IPC1-7): H01L21/324
Attorney, Agent or Firm:
Hidekuma Matsukuma
Next Patent: 半導体基板の製法