Title:
DUMMY BALL FOR ELECTROLYTIC PLATING
Document Type and Number:
Japanese Patent JP2003041398
Kind Code:
A
Abstract:
To provide a dummy ball necessary for forming an external electrode of an electronic component, superior in uniformity of plated film thickness.
The dummy ball for electrolytic plating, which connects a conductor part of an article to be plated, with one electrode, in a plating solution, has 0.98 or higher of the average value of sphericity in 1,000 dummy balls, and includes 1% or less of dummy balls having sphericity of 0.9 or less.
Inventors:
KUBOI TAKESHI
SATO KOJI
DATE MASAYOSHI
SATO KOJI
DATE MASAYOSHI
Application Number:
JP2001229604A
Publication Date:
February 13, 2003
Filing Date:
July 30, 2001
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
B22D21/00; B22D25/02; B22D27/04; B22F1/00; B22F9/08; C25D17/16; (IPC1-7): C25D17/16; B22D21/00; B22D25/02; B22D27/04; B22F1/00; B22F9/08