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Title:
DUST-FREE PACKAGING BAG EXCELLENT IN AUTOMATIC PACKAGING SUITABILITY
Document Type and Number:
Japanese Patent JP2013193748
Kind Code:
A
Abstract:

To provide a dust-free packaging bag for packaging electronic material parts or the like that requires high cleanness, while improving suitability for automatic packaging using an automatic packaging machine.

In a dust-free packaging bag for packaging electronic parts or the like, having at least a sealant layer 2 as an innermost layer, uses a polyester film with a gloss value of 40-130% as an outermost layer film 4, and forms a primer layer or an adhesive layer including an antistatic agent in a substrate layer 3 or on the innermost face. A peak value of an initial charged voltage in a friction voltage pressure test of the surface of the outermost layer film 4 is ≤2.0 kV by absolute value.


Inventors:
KAWAKITA KEITARO
KARATSU MAKOTO
Application Number:
JP2012060657A
Publication Date:
September 30, 2013
Filing Date:
March 16, 2012
Export Citation:
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Assignee:
SHOWA DENKO PACKAGING CO LTD
International Classes:
B65D30/02; B32B27/36; B65D65/40
Domestic Patent References:
JP2009040439A2009-02-26
JP2003026838A2003-01-29
JP2005239751A2005-09-08
JP2009035659A2009-02-19
JP2002200723A2002-07-16
JP2000264390A2000-09-26
JP2002193377A2002-07-10
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu