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Title:
EDGE POLISH DEVICE AND EDGE POLISH METHOD
Document Type and Number:
Japanese Patent JP2004050341
Kind Code:
A
Abstract:

To provide an edge polishing device and an edge polishing method capable of enhancing a polishing speed without generating vibration and waving and decreasing a surface roughness of a polishing surface after polishing by using a polishing pad having a specific multi-layer structure.

The polishing pad 12 comprising a first layer forming a polishing surface and a second layer for supporting the first layer is adhered on a flat surface plate 11 of the edge polishing device. The first layer is a sheet 121 comprising at least one of synthetic resin foam, a resin processing article of unwoven fabric, synthetic leather or a composite article of these. The second layer is a sheet 122 comprising a rubber-like elastic body having compression modulus of elasticity in a range of 200-500 kgf/cm2 and thickness of 0.5-2mm. A ratio (H2/H1) of hardness (H2) of the sheet of the second layer and hardness (H1) of the sheet forming the first layer is 0.8-1.6.


Inventors:
TANAKA HIROAKI
Application Number:
JP2002210222A
Publication Date:
February 19, 2004
Filing Date:
July 18, 2002
Export Citation:
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Assignee:
SPEEDFAM CO LTD
International Classes:
B24B9/00; B24B9/10; B24B37/20; B24B37/22; B24B37/24; (IPC1-7): B24B37/00; B24B9/00; B24B9/10
Attorney, Agent or Firm:
Masakage Amano
Kazuo Sadashige