PURPOSE: To simplify the structure of an infrared-ray radiation thermometer using an elastic surface wave element and to improve characteristics, by providing a piezoelectric substrate so that the opening part of a package base board is covered and a cross-finger type electrode is not contacted with the opening part.
CONSTITUTION: A piezoelectric substrate 1 of an infrared-ray radiation thermometer is bonded so as to cover an opening part 7 of a package base board 2. A crossed-finger type electrode 6 is provided on the surface, which is not contacted with the opening part 7 of the substrate 1. Therefore, an infrared-ray transmitting window, heat insulating posts, and the like are not required, the structure of the infrared-ray radiation thermometer is simplified, and the characteristics such as high sensitivity can be improved.
| JPH01215452 | DEVICE FOR CONTROLLING DIE TEMPERATURE |
| JPH0434322 | THERMOPILE |
| JPH0572043 | RADIANT-HEAT TEMPERATURE SENSOR |
NAGAI TAKESHI
YAMAMOTO KAZUSHI
ITOU SHIYUUJI
| JPS5852527A | 1983-03-28 | |||
| JPS5841330A | 1983-03-10 | |||
| JPS5627640B2 | 1981-06-25 |