Title:
CONDUCTIVE ADHESIVE, AND CONDUCTIVE ADHESIVE SHEET AND ELECTROMAGNETIC WAVE-SHIELDING SHEET USING THE SAME
Document Type and Number:
Japanese Patent JP2016222748
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive which sufficiently disperses and stabilizes conductive fine particles and has good coating productivity, and has high connection reliability, for instance, even after a conductive adhesive sheet and an electromagnetic wave-shielding sheet formed by coating have been subjected to wet heat time treatment and have been folded.SOLUTION: There is provided a conductive adhesive containing a thermosetting resin, a curing agent and conductive fine particles, where the thermosetting resin has a carboxyl group, the conductive fine particles have copper particles and a silver coating layer covering the surface of the copper particles, and concentration of copper atoms of the surface of the conductive composite fine particles is 5-30% in 100% of the total of the concentration of the copper atoms and concentration of the silver atoms.SELECTED DRAWING: Figure 1
Inventors:
HAYASAKA TSUTOMU
KONDO HIROYUKI
MATSUDO KAZUNORI
KONDO HIROYUKI
MATSUDO KAZUNORI
Application Number:
JP2015107080A
Publication Date:
December 28, 2016
Filing Date:
May 27, 2015
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
TOYOCHEM CO LTD
TOYOCHEM CO LTD
International Classes:
C09J9/02; C09J7/00; C09J7/02; C09J11/04; C09J201/08; H01B1/00; H01B1/22; H01B5/14; H05K1/02; H05K9/00
Domestic Patent References:
| JP2009290195A | 2009-12-10 | |||
| JP2004217952A | 2004-08-05 | |||
| JP2009040932A | 2009-02-26 | |||
| JP2005244138A | 2005-09-08 | |||
| JP2013001917A | 2013-01-07 |
Foreign References:
| WO2014010524A1 | 2014-01-16 |