To provide an electrically conductive ink composition formable of the inside of an electric conduction part with few voids and high film density and formable of the electric conduction part at a temperature at which an organic base material can be used, and an electric conduction part produced using the same.

The electrically conductive ink composition comprises a metal powder, a coordinating compound, and copper formate particles, wherein the metal powder comprises a metal powder in which an average particle size ratio of metal particles (B) to metal particles (A) is 0.10-0.45. The electric conduction part is produced by applying or filling the ink composition on or into a base material and heat-treating the base material.