Title:
ELECTRO-OPTICAL DEVICE BOARD, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2002217417
Kind Code:
A
Abstract:
To prevent OSF from being introduced into an electro-optical device board formed on a semiconductor layer, provided on the surface of an insulator layer in a thermal oxidation process, so as to provide an electro-optical device of high reliability.
A single-crystal semiconductor layer with a crystal plane inclined by ±1.0 degree higher than on the basis of {100} plane is pasted on an insulation layer formed on a support board. For instance, {111} plane or {511} plane tends to be harder to introduce OSF than {100} plane, so that an electro-optical device board of high reliability can be obtained.
Inventors:
KAWADA HIROTAKA
Application Number:
JP2001005545A
Publication Date:
August 02, 2002
Filing Date:
January 12, 2001
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/1368; G09F9/30; H01L21/02; H01L21/336; H01L27/12; H01L29/786; (IPC1-7): H01L29/786; G02F1/1368; G09F9/30; H01L21/336; H01L27/12
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)
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