Title:
ELECTROCONDUCTIVE ADHESIVE
Document Type and Number:
Japanese Patent JPH08269423
Kind Code:
A
Abstract:
PURPOSE: To obtain an electroconductive adhesive which can give a cured product having stress relaxation suitable for an FPC board and being excellent in electric conductivity, adhesiveness, heat resistance, humidity resistance, flexibility and workability.
CONSTITUTION: An electroconductive adhesive essentially consisting of a silver powder, a bisphenol A diglycidyl ether epoxy resin, a curing agent, a cure accelerator, a polyvinyl butyral and a solvent, wherein thr ratio of the polyvinyl butyral to the total of the epoxy resin, the curing agent and the cure accelerator is 95/5 to 50/50 by weight, and the ratio of the total of the epoxy resin, the curing agent and the cure accelerator to the silver powder is 85/15 to 55/45 by weight.
Inventors:
TANAKA MASAFUMI
Application Number:
JP9317695A
Publication Date:
October 15, 1996
Filing Date:
March 28, 1995
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C09J163/00; H01B1/22; H05K3/32; (IPC1-7): C09J163/00; C09J163/00; H01B1/22
Attorney, Agent or Firm:
Kamoda Asao