To obtain an electroconductive adhesive that has both high adhesion and good repairing properties and shows high electroconductivity by containing a specific epoxy resin, a phenoxy resin, a specific epoxy compound and an electroconductive filler.

The objective adhesive contains (A) an epoxy resin such as a bisphenol-A type epoxy resin, (B) a phenoxy resin, (C) a liquid epoxy compound that has a viscosity at 25°C of preferably 1-200 cP, more preferably 1-100 cP, particularly 1-50 cP and bears at least one glycidyl group in one molecule, and (D) 65-90 wt.% of an electroconductive filler. In a preferred embodiment, the contents of the organic binders [the components A, B and C except the filler (the component D)] are 5-70 wt.%, 1-20 wt.% and 5-70 wt.%, respectively. This adhesive may contain, when necessary, a curing agent, a solvent, a diluent, a curing accelerator, a leveling agent, a thixotropy-imparting agent, a sedimentation inhibitor, a flame retarder, a pigment and the like.