To provide a polymer-type electroconductive coating that can form an electroconductive coating having a low connection resistance.
The electroconductive coating comprises a silver powder containing 40-200 ppm of a Na ion, which is obtained by washing with water silver particles obtained by chemical reduction deposition of silver nitrate by adding thereto sodium carbonate or sodium hydroxide together with formalin so that electroconductivity at the time of final washing falls within the range of 50-300 μS/cm, a thermoplastic resin and a solvent, where the weight ratio of the silver powder to the thermoplastic resin is within the range from 87:13 to 95:5 and the weight ratio of the total solid content of the silver powder and the thermoplastic resin to the solvent is within the range from 95:5 to 30:70.
COPYRIGHT: (C)2008,JPO&INPIT
KOMATSU MICHIO
YASUDA EITARO
SAITO TAKESHI
NEC TOKIN CORP
| JP2006049147A | 2006-02-16 | |||
| JPH02245070A | 1990-09-28 | |||
| JP2003253312A | 2003-09-10 |
Uemura Yoshinaga