Title:
ELECTROCONDUCTIVE RESIN MOLDING
Document Type and Number:
Japanese Patent JP3409232
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin molding capable of homogeneously giving volume resistivity and surface resistivity over the whole molding, in high accuracy and suitable as parts for the image forming apparatus, etc., by molding polyaniline and electroconductive filler with an insulating matrix polymeric material.
SOLUTION: This molding comprises (A) polyaniline, and (B) electroconductive filler (preferably carbon black), and (C) an electric insulating matrix polymeric material (preferably polyimide). For example, as the component A, a compound which has quinonediimine structural unit and phenylenediamine structural unit of the formula [(m) and (n) are each mole fraction of quinonediimine structural unit and phenylenediamine structural unit in the repeating unit, 0<(m)<1, 0<(n)<1, (m)+(n)=1] as the main repeating unit, and is soluble in a solvent as the state of dedope is used. A preferable composition comprises 2.5-25wt.% ingredient A, 2-7.5wt.% ingredient B and 70-95wt.% ingredient C.
Inventors:
Yoshihiro Uetani
Zenichi Ueda
Zenichi Ueda
Application Number:
JP34044195A
Publication Date:
May 26, 2003
Filing Date:
December 27, 1995
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C08J5/00; C08K3/04; C08L79/00; C08L79/02; C08L79/08; (IPC1-7): C08J5/00; C08K3/04; C08L79/00
Domestic Patent References:
| JP463865A | ||||
| JP790179A | ||||
| JP5262991A | ||||
| JP6264828A |
Attorney, Agent or Firm:
Itsuro Makino