Title:
電鋳金型製造方法
Document Type and Number:
Japanese Patent JP7317637
Kind Code:
B2
Abstract:
To provide an electroformed mold manufacturing method which can accurately impart a structure to a resin member even when the structure is fine and delicate.SOLUTION: A recess 3a of a first substrate 3 and a recess 6a of a second substrate 6 are arranged and joined in an opposite positional relation. A surface opposite to a joint surface of the second substrate 6 is polished, and a part of a recessed space formed by oppositely arranging the recess 3a of the first substrate 3 and the recess 6a of the second substrate 6 is exposed. Electric power is supplied to a first metal layer 5 positioned on the joint surface between the first substrate 3 and the second substrate 6 and a second metal layer 9 formed on an opening 6b formation surface of the second substrate 6, and the metal layers are plating grown by an electrolytic plating method. Thereby, the recessed space is plating filled, and a metal plating shape part 10 is formed on the surface of the second substrate 6 including the opening 6b of the second substrate 6 connected to the recessed space by securing a fixed thickness. Subsequently, the first substrate 3 and the second substrate 6 are dissolved and removed, and only the metal plating shape part 10 is exposed.SELECTED DRAWING: Figure 4
Inventors:
Kazuhiro Toriumi
Application Number:
JP2019159082A
Publication Date:
July 31, 2023
Filing Date:
August 30, 2019
Export Citation:
Assignee:
Citizen Fine Device Co., Ltd.
International Classes:
C25D1/10; B29C33/38; B81C99/00; C25D1/00
Domestic Patent References:
| JP10109313A | ||||
| JP2010216014A | ||||
| JP2016113653A |