Title:
電鋳金型製造方法
Document Type and Number:
Japanese Patent JP7317638
Kind Code:
B2
Abstract:
To provide an electroformed mold manufacturing method which can accurately impart a structure to a resin member even when the structure is fine and delicate.SOLUTION: A recess 3a is formed on a first substrate 3, the inside of the recess 3a including an inner surface of the recess 3a of the first substrate 3 is plating filled, and a plating layer 5a is formed. A second substrate 7 is prepared similarly to the first substrate 3, and each of the substrates is stuck to each other. In a positional relation of stuck substrates, the plating layer 5 that is made to fill the recess 3a of the first substrate 3 and the plating layer 5a of the recess 7a of the second substrate 7 are opposite to each other. The surface of the second substrate 7 is polished, a part of the plating layer 5a is exposed, and a second metal film 8 is formed on the surface. Electric power is supplied to the second metal layer 8, and the surface of the second substrate 7 is metal plated by an electrolytic plating method. Thereby, the second substrate is coupled to the plating layer 5a in the recess, and a metal plating shape part 9 is formed. Finally, the first substrate 3 and the second substrate 7a are dissolved and removed.SELECTED DRAWING: Figure 3
Inventors:
Kazuhiro Toriumi
Application Number:
JP2019159083A
Publication Date:
July 31, 2023
Filing Date:
August 30, 2019
Export Citation:
Assignee:
Citizen Fine Device Co., Ltd.
International Classes:
C25D1/10; B29C33/38; B81C99/00; C25D1/00
Domestic Patent References:
| JP2016113653A | ||||
| JP2010216013A | ||||
| JP2001115293A |