Title:
ELECTROLESS GOLD PLATING SOLUTION
Document Type and Number:
Japanese Patent JP3831842
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electroless gold plating solution which can form a good plating film on an electroless nickel plating film and can minimize the corrosion of the nickel plating film.
SOLUTION: The electroless gold plating film contains (i) a water-soluble gold compound, (ii) a complexing agent, (iii) at least one component selected from the group consisting of acids including chalcogen elements of an oxidation number 2 to 4 and their salts, (iv) at least one component selected from the group consisting of hydrazine and its derivative, and (v) a compound having an ethylene group including ≥2 imono groups within the molecule and having a substituent in some cases between the nitrogen atoms of the imino group.
Inventors:
Kaoru Naito
Katsushige Iwamatsu
Teruaki Shimoji
Kimiko Kudo
Naomi Murase
Katsushige Iwamatsu
Teruaki Shimoji
Kimiko Kudo
Naomi Murase
Application Number:
JP2002082882A
Publication Date:
October 11, 2006
Filing Date:
March 25, 2002
Export Citation:
Assignee:
Okuno Pharmaceutical Co., Ltd.
International Classes:
C23C18/44; H05K3/18; (IPC1-7): C23C18/44; H05K3/18
Domestic Patent References:
| JP6280039A | ||||
| JP2001107259A | ||||
| JP9171714A | ||||
| JP9209164A | ||||
| JP10001778A |
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
Kakehi Yuro
Takeshi Ohara
Hiroji Nakagawa
Yasumitsu Tate
Kenji Saito
Jun Fujii
Hitoshi Seki
Mutsuko Nakano
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