Title:
ELECTROLESS PLATING LIQUID COMPOSITION CONTROL DEVICE
Document Type and Number:
Japanese Patent JPS62186309
Kind Code:
A
Abstract:
PURPOSE:To supplying the composition part decreased by an electroless plating with a real time, to keep the composition of a plating liquid stably and to execute the electroless plating with a good quality by knowing the presence or the absence of the electroless plating object in a plating tank with the real time. CONSTITUTION:By providing a sensor 3 to detect that an electroless plating object is in a plating tank and a detecting signal converter 7 to convert it to a signal of 1-n and transfer it to a microprocessor 4, the microprocessor 4 can know the presence or the absence of the electroless plating object in the plating tank. Consequently, simultaneously when plating is started, the supplying of Ni and alkali to match with a plating quantity can be started and when the plating is completed, the supplying can be instantaneously stopped. Namely, when the electroless plating object exists in the plating tank, based on the supplying quantity of the constant quantity decreased by the electroless plating, the supplying is executed by adding or subtracting the result of the plating liquid analysis at the constant interval.
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Inventors:
URANO YASUHIRO
Application Number:
JP2854186A
Publication Date:
August 14, 1987
Filing Date:
February 12, 1986
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G05D21/00; (IPC1-7): G05D21/00
Attorney, Agent or Firm:
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