ELECTROLYTIC COPPER FOIL, PRODUCTION METHOD THEREOF, COPPER CLAD LAMINATE, PRINTED WIRING BOARD AND PRODUCTION METHOD THEREOF, AND PRODUCTION METHOD OF ELECTRONIC APPARATUS

Title:

ELECTROLYTIC COPPER FOIL, PRODUCTION METHOD THEREOF, COPPER CLAD LAMINATE, PRINTED WIRING BOARD AND PRODUCTION METHOD THEREOF, AND PRODUCTION METHOD OF ELECTRONIC APPARATUS

Document Type and Number:

Japanese Patent JP2018076601

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an electrolytic copper foil having excellent circuit formability.SOLUTION: The electrolytic copper foil does not contain a roughening treatment layer at the side of a glossy surface, and the root mean square height of the glossy surface is below 0.315 μm or less.SELECTED DRAWING: Figure 1

Inventors:

INUKAI KENJI
KOBAYASHI YOSUKE
IIDA KAZUHIKO

Application Number:

JP2018002084A

Publication Date:

May 17, 2018

Filing Date:

January 10, 2018

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP

International Classes:

C25D1/04; B32B15/04; B32B15/20; C25D1/00; C25D5/16; C25D7/06; H05K1/09

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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