Title:
ELECTROLYTIC COPPER PLATING SOLUTION AND METHOD FOR ELECTROLYTIC COPPER PLATING
Document Type and Number:
Japanese Patent JP2013249515
Kind Code:
A
Abstract:
To provide an electrolytic copper plating solution which includes a specific compound containing a sulfur atom, and is also suitable for forming filled vias without using formaldehyde and without causing worsening of the external appearance of plating; and to provide a method for electrolytic copper plating using the plating solution.
An electrolytic copper plating solution includes a compound having a -X-S-Y- structure (wherein, X and Y are individually atoms selected from the group comprising hydrogen, carbon, sulfur, nitrogen and oxygen atoms, and X and Y can be the same only when they are carbon atoms) and a specific nitrogen-containing compound. A method for electrolytic copper plating using the plating solution is also provided.
Inventors:
SAITO ATSUKO
SAKAI MAKOTO
MIZUNO YOKO
MORINAGA TOSHIYUKI
HAYASHI SHINJIRO
SAKAI MAKOTO
MIZUNO YOKO
MORINAGA TOSHIYUKI
HAYASHI SHINJIRO
Application Number:
JP2012125008A
Publication Date:
December 12, 2013
Filing Date:
May 31, 2012
Export Citation:
Assignee:
ROHM & HAAS DENSHI ZAIRYO KK
International Classes:
C25D3/38
Domestic Patent References:
| JP2011063843A | 2011-03-31 | |||
| JP2002249891A | 2002-09-06 | |||
| JP2000273684A | 2000-10-03 | |||
| JP2004091882A | 2004-03-25 | |||
| JPS57158246A | 1982-09-30 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office