To provide a silver plating solution capable of stabilizing mounting reliability, light reflection characteristics, and corrosion resistance (particularly resistance to sulfurization corrosion) to a lead frame or a substrate of an optical semiconductor device and capable of improving these characteristics; and a plating method using the silver plating solution.
An electrolytic silver plating solution for a lead frame or a substrate of an optical semiconductor device is prepared by adding a soluble compound including at least one selected from the group consisting of Ti, Zr, V, Mo, W, Co, Pd, Au, Cu, Zn, Ga, Ge, In, Sn, Tl, Sb, Bi, As, P, Te, Br, and I in a concentration range of 5 mg/L to 10 g/L to a silver plating solution including 20-250 g/L of a cyanide silver complex, 50-200 g/L of a free cyanogen salt and at least either one of a selenium compound and a sulfur compound. The electrolytic silver plating solution has a pH of 10-14.
| WO/2019/117279 | METHOD FOR REFINING CRYSTAL GRAINS IN PLATING FILM |
| WO/2015/006400 | PLATED POLYMERIC WIND TURBINE COMPONENTS |
TSUNANO MASANORI
SAKAMOTO MASAKAZU
| JP2001049487A | 2001-02-20 | |||
| JPS60159192A | 1985-08-20 | |||
| JPS495818B1 | 1974-02-09 | |||
| JPS59232288A | 1984-12-27 | |||
| JPH06173074A | 1994-06-21 | |||
| JPS4537844B1 | ||||
| JPS56156790A | 1981-12-03 | |||
| JPH06184789A | 1994-07-05 |
| WO2004048646A1 | 2004-06-10 |
Kyousei Tamura
Keiichi