Title:
ELECTRONIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH1174637
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic circuit board which can contribute to the high volume productivity and cost reduction of an electronic circuit, by improving the connecting strength in mounting a BGA(ball grid array) package on the board. SOLUTION: In an electronic circuit board 10 for connecting electronic parts 11 on which connecting terminals having the same shape are arranged in a grid, lands A-G are formed corresponding to the connecting terminals in such a state that parts of the lands A-G are coupled with each other. The lands coupled with each other are faced to the connecting terminals at four corners of the parts 11. Then, the coupled lands are subject to preliminary soldering treatment, such as the cream solder printing, etc. In addition, the circuit board is constituted in a flexible printed board.
Inventors:
ARAKAWA KAZUHIKO
Application Number:
JP23421397A
Publication Date:
March 16, 1999
Filing Date:
August 29, 1997
Export Citation:
Assignee:
CANON KK
International Classes:
H05K3/34; H05K1/11; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Masayuki Kishida (3 outside)
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