Title:
ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2725637
Kind Code:
B2
Abstract:
PURPOSE: To provide an electronic circuit device for surface mounting which is highly integrated and has an improved packaging property and its manufacturing method.
CONSTITUTION: A chip component 4 and a semiconductor element 5 are mounted in a recessed part 9 of a wiring board 1 and the surface is formed so that it is a concave surface from the main surface of the wiring board. Then, a frame 8 is mounted and a semiconductor element and other electronic components are mounted by the wire bonding method on the opposite surface of the wiring board 1 and the inside of the frame is sealed so that the surface becomes flat at least at nearly the central part with a sealing resin 7'. The sealing parts on both surfaces of the wiring board 1 should be in nearly the same dimensions and should be sealed with the same resin, thus achieving a thin electronic circuit device with improved surface suction performance, less warpage, and improved packaging property where a semiconductor element is mounted on both surface.
Inventors:
HOSOYA FUTOSHI
Application Number:
JP13397395A
Publication Date:
March 11, 1998
Filing Date:
May 31, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L23/24; H01L25/04; H01L25/065; H01L25/07; H01L23/28; H01L25/16; H01L25/18; H05K3/28; (IPC1-7): H01L25/065; H01L25/04; H01L25/07; H01L25/18
Domestic Patent References:
| JPS6212948B2 | ||||
| JPS594642B2 |
Attorney, Agent or Firm:
Naoki Kyomoto
Previous Patent: SOLDER PRINTER AND SOLDER PRINTING METHOD
Next Patent: PREVENTION OF POLYMERIZATION OF (METH)ACRYLIC ACID AND ITS ESTER
Next Patent: PREVENTION OF POLYMERIZATION OF (METH)ACRYLIC ACID AND ITS ESTER