Title:
SOLDER PRINTER AND SOLDER PRINTING METHOD
Document Type and Number:
Japanese Patent JP2725635
Kind Code:
B2
Abstract:
PURPOSE: To correspond to the file pitch of cream solder printing on a printed board by using a metal mask.
CONSTITUTION: A printed board 1 is bonded with a metal mask 5 and a cream solder 8 is printed. The printed board 1 and the metal mask 5 are lifted by the given acceleration after printing. At that time, inertia force toward the printed board 1 is applied to the cream solder 8. The metal mask 5, therefore, is lifted by the speed faster than the board 1, and when the printed board 1 is separated from the metal mask 5, inertia force is added to the adhesion of the cream solder 8 with the printed board 1. Therefore, the force larger than the adhesion to the wall face of the metal mask can be provided. The printed board 1, therefore, is separated from the metal mask 5, and the cream solder is transferred to the board without cuts or thin spots.
Inventors:
MUROYA HIROSHI
Application Number:
JP13222795A
Publication Date:
March 11, 1998
Filing Date:
May 30, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B41F15/08; B41F15/26; B41F15/36; H05K3/12; (IPC1-7): B41F15/08; B41F15/26; B41F15/36
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)