To provide an electronic component wherein terminals can be easily electrically and thermally conductively connected.

In this electronic component wherein the terminals facing each other are connected with an conductive composition containing conductive particles and a binder composition, the relative pack density of the conductive particles in the conductive composition is 60 to 80%, and the terminals facing each other are metallurgically bonded through silver fines in the conductive particles. In the manufacturing method for the electronic component connecting the terminals facing each other with the conductive composition containing the conductive particles and the binder composition, after applying the conductive composition to one terminal with which a conductive paste which is pasted is connected, the terminal is put together with the other terminal through the conductive paste to connect the terminals facing each other.