Title:
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2016162885
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component superposing semiconductor elements, capable of constituting a compact electronic component, facilitating the connection of the wiring, of one kind of semiconductor element, and to provide a method of manufacturing the electronic component.SOLUTION: In an electronic component superposing one kind of semiconductor elements 11, 12, where first and second surface electrodes are formed on the surface and a back electrode is formed on the back, the second surface electrodes 11G, 12G are formed at positions closer to the marginal part than the central part, and a through hole 12K or a notch is formed in the semiconductor elements, at a position closer to the marginal part than the central part, where neither the first surface electrode 12S nor the second surface electrode 12G are formed. The first and second semiconductor elements 11, 12 are superposed so that the second surface electrode 12G of the first semiconductor element 11 is aligned with the through hole 12K or notch of the second semiconductor element 12.SELECTED DRAWING: Figure 10
Inventors:
WAKITA YASUYUKI
Application Number:
JP2015040279A
Publication Date:
September 05, 2016
Filing Date:
March 02, 2015
Export Citation:
Assignee:
JTEKT CORP
International Classes:
H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Okada International Patent Office