To provide an electronic component module high in airtightness and reliability, and to provide a method of manufacturing the same.

This electronic component module includes: a substrate 2 formed of an insulation material; an SAW device chip 10 flip-chip-mounted on the upper face of the substrate 2; chip components 12 mounted on the upper surface of the substrate 2; sealing solder 18 for sealing the SAW device chip 10 and the chip components 12 to separate from at least one of electrodes of chip components 12; a lid 16 arranged above the SAW device chip 10 and the chip components 12 and on the sealing solder 18; and an insulating material 20 arranged between the upper surfaces of the chip components 12 and the lid 16. This method of manufacturing the same is also provided.