To provide an electronic component-mounted substrate module which has lead terminals having high mounting strength, can contribute to miniaturization of a substrate, and has no increase in the number of manufacturing processes and cost, and to provide a manufacturing method thereof.

The substrate module is provided with an insulative substrate 12 on which a predetermined electronic component 14 is mounted, a plurality of first through holes 15 which are each provided along the end edge of the substrate 12 and formed so as to set close to the end surface of the substrate 12 or be partly opened, and a plurality of second through holes 16 which are each close to the first through holes 15 and positioned inside of the substrate 12. The substrate module is provided with conductors which are each formed on the inner wall surface of each of the second through holes 16 and connected to a circuit pattern of the surface of the substrate, a plurality of lead terminals 13 which correspond to the first and second through holes 15, 16, and insertion ends 17, 18 which are integrally provided on each of the lead terminals 13 and forced into the first and second through holes 15, 16. Each of the lead terminals 13 is formed on a terminal to be surface-mounted, and the insertion end 18 is soldered on the substrate 12.