Title:
ELECTRONIC COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP3460632
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component mounting device of a structure, wherein a correction of the angles of electronic components at the pickup of the components can be realized by a simple and low-cost mechanism.
SOLUTION: In an electronic component mounting device of a structure, wherein chips 5 are mounted on a substrate by an electronic component mounting part, a plurality of pickup heads 12, which are respectively provided with a chucking nozzle 31 for picking up each chip 5, and an angle correcting unit 13 are provided on a delivery part, which picks up the chips 5 from a feeding part to deliver the chips to the electronic component mounting part, and the rotational phase of a cam material 50 is changed on the basis of the misalignments Δθ, of the chips 5 which are detected by a recognition, whereby the incremental advance of a push-butting pin 48 is adjusted to contrive to correct the angles of rotation of the nozzles 31. As a result, dispersion in the angles of the components at the pickup of the components can be corrected by the simple and low-cost structure of the mounting device.
Inventors:
Tomoaki Nakanishi
Application Number:
JP21045299A
Publication Date:
October 27, 2003
Filing Date:
July 26, 1999
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; B25J17/02; H01L21/52; H05K13/08; (IPC1-7): H01L21/52; B25J17/02; H05K13/04; H05K13/08
Domestic Patent References:
| JP2222155A | ||||
| JP1064930A | ||||
| JP4348534A | ||||
| JP58123787A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)