Title:
BASE FOR ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
Japanese Patent JP2023002062
Kind Code:
A
Abstract:
To improve reliability of mounting joint between an electronic component package and a circuit board by preventing cracks of electric conductive joint material such as solder.SOLUTION: An electronic component package has an external terminal 12 formed on a base 1 for holding an electronic component element 3. The external terminal 12 includes a main surface terminal 13 formed on a bottom surface of the base and side surface terminals 14, 15 formed on side surfaces of the base. The main surface terminal 13 and the side surface terminals 14, 15 are formed so as to connect with each other at the bottom surface and the side surface of the base. The side surface terminals 14, 15 are formed at positions outside the width of the main surface terminal 13.SELECTED DRAWING: Figure 2
Inventors:
OKAMAE YUKI
Application Number:
JP2021103067A
Publication Date:
January 10, 2023
Filing Date:
June 22, 2021
Export Citation:
Assignee:
DAISHINKU CORP
International Classes:
H03H9/02; H01L23/12