To solve a problem in which heat is not sufficiently radiated from the housing member outer wall surface side to atmospheric air in a structure where a protruding part located close to a heating portion is simply formed at the inner wall surface side of a housing member.
In a case 12 facing a heating portion of a circuit board 11, on which an electronic component 14b generating heat is mounted, from among the circuit board 11 housed in a housing internal space formed by joining the case 12 and a cover 13 etc. to each other, a heat radiation part 20, which includes: a protruding part 21 located close to the heating portion; and a recessed part 22 that opens to the outer wall surface side of the case 12 at a position in a thickness direction of the protruding part, the recessed part 22 where a side wall is formed into a tapered shape and an opening area is larger than a bottom area, is formed. A thickness of the heat radiation part 20 is thinner than the peripheral side of the heat radiation part 20.
FUKUZAWA TAKAYUKI
| JP2003289191A | 2003-10-10 | |||
| JP2007123641A | 2007-05-17 | |||
| JPH11163566A | 1999-06-18 | |||
| JP2006294754A | 2006-10-26 |
| US6365964B1 | 2002-04-02 |
Tomioka Kiyoshi
Tsuyoshi Hashimoto