Title:
ELECTRONIC DEVICE, MANUFACTURING METHOD THEREFOR AND SURFACE MOUNT PASSIVE COMPONENT
Document Type and Number:
Japanese Patent JP2006245490
Kind Code:
A
Abstract:
To prevent crack when a surface mount passive component is mounted.
By protruding the uppermost part of a connecting terminal 16e in a chip component 16 constituting a high frequency power amplifying circuit, from the uppermost part of a protective film by 3.0μm or more, the chip component 16 can be mounted on a module substrate MCB in such a state that the component 16 is picked up so that a suction nozzle 101 is brought into contact with the connecting terminals 16e at the both ends of the chip component 16, when the chip component 16 is mounted. Thereby the crack is prevented when the chip component 16 is mounted.
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Inventors:
SATO YUSUKE
SHIMOISHI TOMOAKI
NAKAJIMA KOICHI
OGIWARA TATEAKI
SHIMOISHI TOMOAKI
NAKAJIMA KOICHI
OGIWARA TATEAKI
Application Number:
JP2005062619A
Publication Date:
September 14, 2006
Filing Date:
March 07, 2005
Export Citation:
Assignee:
RENESAS TECH CORP
International Classes:
H01C1/142
Attorney, Agent or Firm:
Yamato Tsutsui