Title:
EQUIPMENT AND METHOD FOR HEAT TREATING SUBSTRATE
Document Type and Number:
Japanese Patent JP2006245492
Kind Code:
A
Abstract:
To provide equipment and a method for heat treating a substrate in which a surface temperature in a treatment chamber can be prevented suitably from lowering.
The equipment for heat treating a substrate arranged in a treatment chamber comprises the treatment chamber containing the substrate in a gas atmosphere surrounded by an inner wall face member, a low heat resistance member 10 arranged at a position subjected to thermal effect of the inner wall face member in the vicinity of the exterior of the process chamber, a mechanism for cooling the low heat resistance member, and a mechanism for interrupting cooling action to the inner wall face member provided between the low heat resistance member 10 and the inner wall face member.
Inventors:
HARASHIMA HIROYUKI
MATSUURA ISATAKE
ENOMOTO TATSUYA
MATSUURA ISATAKE
ENOMOTO TATSUYA
Application Number:
JP2005062665A
Publication Date:
September 14, 2006
Filing Date:
March 07, 2005
Export Citation:
Assignee:
GASONICS KK
International Classes:
H01L21/324; H01L21/31
Domestic Patent References:
| JPH08124869A | 1996-05-17 | |||
| JPH03291917A | 1991-12-24 | |||
| JPH08115885A | 1996-05-07 | |||
| JPH11214377A | 1999-08-06 | |||
| JPH0922902A | 1997-01-21 | |||
| JPH0337189A | 1991-02-18 | |||
| JP2004247655A | 2004-09-02 | |||
| JP2004319979A | 2004-11-11 | |||
| JP2004063523A | 2004-02-26 | |||
| JP2002313796A | 2002-10-25 | |||
| JPH07183242A | 1995-07-21 |
Attorney, Agent or Firm:
Yasuo Ishikawa