ELECTRONIC DEVICE MODULE COOLING STRUCTURE

Title:

ELECTRONIC DEVICE MODULE COOLING STRUCTURE

Document Type and Number:

Japanese Patent JPS6329999

Kind Code:

A

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Inventors:

SUZUKI MITSUAKI
ARAI KATSUSHI
KOJIMA YASUSHI
SAKIURA JIYUN

Application Number:

JP17170186A

Publication Date:

February 08, 1988

Filing Date:

July 23, 1986

Export Citation:

Assignee:

FUJITSU LTD

International Classes:

H01L35/30; H01L23/38; H01L35/28; H05K7/20; (IPC1-7): H01L23/38; H01L35/28; H05K7/20

Attorney, Agent or Firm:

Aoki Akira

Previous Patent: The drive circuit of the switching element for electric power control

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