Title:
電磁波保護層を有する電子装置及びその製造方法
Document Type and Number:
Japanese Patent JP6770050
Kind Code:
B2
Abstract:
Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
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Inventors:
Jeong, Seyoung
Junwoo
Kim, Yun Hyun
Ju, kiss
Lee, Kyuje
Junwoo
Kim, Yun Hyun
Ju, kiss
Lee, Kyuje
Application Number:
JP2018223044A
Publication Date:
October 14, 2020
Filing Date:
November 29, 2018
Export Citation:
Assignee:
Entrium Inc.
International Classes:
H01L23/00; B05D1/02; B05D3/02; B05D7/00; B05D7/24; B32B9/00; B32B15/01; H01L23/28; H05K9/00; B22F1/068; B22F1/08; B22F1/107; B22F1/16; B22F1/17
Domestic Patent References:
| JP2010123645A | ||||
| JP2017066443A | ||||
| JP2017520903A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Kato Kazunori