To prevent a semiconductor element and a wiring board from being adversely affected, even if liquid leaks in respective connection parts and a heating part in the cooling device of an electronic unit in a system where liquid is circulated, and the semiconductor element is cooled.
An electronic device is provided with a first casing loading the semiconductor element 1, and a second casing which stores a display device 4 and is rotatably supported by the first casing. The device is also provided with a heating member 5, which is thermally brought into contact with the semiconductor element 1, a heat radiating member 7 which is thermally brought into contact with the inner face of the second casing, a liquid driving means 8 which drives a liquid medium between the heat radiating member, and the heating member and which is stored in the first casing and a tube 9 connecting the heating member 5, the heat radiating member 7, and the liquid driving means 8. The connection part and the heating part are covered by a cover formed of a water-absorbing material.
OHASHI SHIGEO
KONDO YOSHIHIRO
OSANAWA TAKASHI
NAKAGAWA TAKESHI
SASAKI NAOYA
KITANO MAKOTO
MINAMITANI RINTARO
YOSHITOMI YUJI
