Title:
ELECTRONIC LIQUID COOLING SYSTEM HAVING A PLURALITY OF PUMPS
Document Type and Number:
Japanese Patent JP2005315255
Kind Code:
A
Abstract:
To provide an electronic cooling system capable of protecting components susceptible to heat even in the event of pump failure by using pumps not expensive nor having a high reliability.
A pump assembly according to the present invention is equipped with inlet and outlet interfaces capable of coupling to a liquid cooling loop tubing, a plurality of pump connectors coupled to the interfaces and so that a plurality of pumps can be coupled to the interfaces on plug-in system, and a controller coupled to the pumps, controllable for the power level of each pump, and controlling the fluid flow rate in the liquid cooling loop.
Inventors:
MALONE CHRISTOPHER G
SIMON GLENN C
SIMON GLENN C
Application Number:
JP2005108332A
Publication Date:
November 10, 2005
Filing Date:
April 05, 2005
Export Citation:
Assignee:
HEWLETT PACKARD DEVELOPMENT CO
International Classes:
F04D15/00; F04B19/00; F04B23/06; F04B39/00; F04B49/00; F04D13/12; H01L23/473; H05K7/20; (IPC1-7): F04D15/00; F04D13/12; H05K7/20
Attorney, Agent or Firm:
Masaki Goto
Yoshio Matsuda
Hideo Ueno
Masaaki Iida
Yoshio Matsuda
Hideo Ueno
Masaaki Iida
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